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1. general description the mifare mf0icu1 has been developed by nxp semiconductors for use with proximity coupling devices (pcd) in accordance with iso/iec 14443 a (see ref. 1 ). it is intended for use with single trip tickets in public transportation networ ks, loyalty cards or day passes for events as a replacement for c onventional ticketing solutions such as paper tickets, magnetic stripe tickets or coins. as the usage of contactless proximity sm art cards becomes more and more common, transport and event operators are switching to completely contactless solutions. the introduction of the mifare ult ralight for limited use tickets will lead to a reduction of system installation and main tenance costs. terminals will be less vulnerable to damage and mechanical failures caused by ticket jams. mf0icu1 can easily be integrated into existing schemes and even standard paper ticket vending equipment can be upgraded. this solution for low cost tickets can help operators to reduce the circulation of cash within the system. the mechanical and electronical specifications of mifare ultralight are tailored to meet the requirements of paper ticket manufacturers. 1.1 key applications ? limited use tickets for public transport ? limited use tickets for event ticketing 1.2 contactless energy and data transfer mf0icu1 is connected to a coil with a fe w turns. the mf0icu1 fits the tfc.0 (edmondson) and tfc.1 (iso) ticket formats as defined in bs en753-2. tfc.1 format tickets are supported by the mf0i cu10 chip which features a 17 pf on-chip resonance capacitor. the smaller tfc.0 format tickets are support ed by the mf0icu11 chip which features a 50 pf on-chip resonance capacitor. 1.3 anticollision an intelligent anticollision f unction enables si multaneous multicar d operation. the anticollision algorithm individually selects ea ch card and ensures co rrect execution of a transaction with the selected card without data corruption from other cards in the field. mf0icu1 mifare ultralight contactless single-ticket ic rev. 3.8 ? 22 december 2010 028638 product data sheet public
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 2 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 1.3.1 cascaded unique identification (uid) the anticollision function is based on an ic individual serial number called unique identification (uid) for each ic. the uid of the mf0icu1 comprises 7 bytes and supports iso/iec 14443-3 cascade level 2. 1.4 security ? 7-byte uid in accordance with iso/iec 14443-3 for each device ? 32-bit user definable one-time programmable (otp) area ? field programmable read-only locking function per page 1.5 delivery options mf0icu1 can be delivered in packaged or wafer form. refer to delivery type description for more information. evaluations show that an operating distance of appr oximately 8 cm can be achiev ed with this ticket configuration (6 turn coil) using a mifare demonstration- system. fig 1. mifare card reader 001aah99 8 coil: 20 mm coil: 56 mm tfc.0 energy directly mounted ic data mifare card pcd
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 3 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 2. features and benefits 2.1 mifare rf interface iso/iec 14443 a ? contactless transmission of data and supply energy (no battery needed) ? operating distance up to 100 mm depending on antenna geometry ? operating frequency of 13.56 mhz ? data transfer of 106 kbs ? data integrity of 16-bit crc, parity, bit coding, bit counting ? anticollision ? 7-byte serial number in accordance with iso/iec 14443-3 cascade level 2 ? typical ticketing transaction time of < 35 ms ? fast counter transaction time of < 10 ms 2.2 eeprom ? 512-bit, organized in 16 pages with 4 bytes per page ? field programmable read-only locking function per page ? 32-bit user definable one-time programmable (otp) area ? 384-bit user read/write area (12 pages) ? data retention time of 5 years ? write endurance 10000 cycles 3. ordering information table 1. ordering information type number package commercial name name description version mf0icu1001w/s7dl ffc - 8 inch wafer (sawn; 75 m thickness, on film frame carrier; electronic fail die marking according to secsii format) see section 7 and section 8 , 17 pf input capacitance - MF0ICU1101W/s7dl ffc - 8 inch wafer (sawn; 75 m thickness, on film frame carrier; electronic fail die marking according to secsii format) see section 7 and section 8 , 50 pf input capacitance - mf0icu1001w/u7dl ffc - 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to secsii format) see section 7 and section 8 , 17 pf input capacitance - MF0ICU1101W/u7dl ffc - 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to secsii format) see section 7 and section 8 , 50 pf input capacitance - mf0moa4u10/d moa4 pllmc plastic leadless module carrier package; 35 mm sot500-2 wide tape, 17 pf input capacitance sot500-2
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 4 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 4. block diagram 5. pinning information 5.1 contactless smart card module fig 2. block diagram 001aal33 9 antenna rf interface digital control unit eeprom anticollision command interpreter eeprom interface fig 3. contact assignments for sot500-2 (moa4) table 2. bonding pad assignments to smart card contactless module contactless interface module mf0icu1da4/01 antenna contacts symbol description la la antenna coil connection la lb lb antenna coil connection lb 001aaj82 0 la lb top view
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 5 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 6. mechanical specification 6.1 fail die identification the wafers are not inked. electronic wafer mapping (secs ii format) co vers the electrical test results and the additional mechanical/visual inspection results. table 3. specifications wafer diameter 200 mm (8 inches) maximum diameter afte r foil expansion 210 mm thickness 120 m 15 m (u7dl types) 75 m 15 m (s7dl types) flatness not applicable potential good dies per wafer (pgdw) 72778 wafer underside material si flatness not applicable roughness r a max = 0.5 m r t max = 5 m chip dimensions step size x = 645 m y = 665 m gap between chips typical = 20 m minimum = 5 m passivation type sandwich structure material psg/nitride (on top) thickness 500 nm/600 nm au bump (substrate connected to vss) material 99.9 % pure au hardness 35 to 80 hv 0.005 shear strength >70 mpa height 18 m height uniformity within a die = 2 m within a wafer = 3 m wafer to wafer = 4 m flatness minimum = 1.5 m size la, lb and vss = 90 m 90 m testio = 60 m 60 m size variation 5 m under bump metallization sputtered tiw
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 6 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 7. chip orientation and bondpad locations (1) the air gap between dies may vary due to foil expansion. all dimensions in m. pad locations measured from die center. fig 4. chip orientation and bondpad locations 001aal53 1 231.0 bump size la, lb, vss testio chip step 90 60 645 (1) 90 x ( m) y ( m) 60 665 (1) la testio lb vss typ. 20.0 (1) min. 5.0 215.0 246.0 231.0 typ. 645.0 (1) typ. 20.0 (1) min. 5.0 241.7 125.5 256.7 typ. 665.0 (1) 189.9
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 7 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8. functional description 8.1 block description the mf0icu1 chip consists of a 512-bit eepr om, rf interface and digital control unit (dcu). energy and data are transferred via an antenna consisting of a coil with a small number of turns which is directly connected to the mf0icu1. no further external components are necessary. refer to the document ref. 6 ? mifare (card) coil design guide ? for details on antenna design. ? rf interface: ? modulator/demodulator ? rectifier ? clock regenerator ? power-on reset (por) ? voltage regulator ? anticollision: multiple cards may be selected an d managed in sequence ? command interpreter: processes commands supported by the mf0icu1 to access the memory ? eeprom interface ? eeprom: 512 bits, organized in 16 pages of 4 bytes per page. ? 80 bits reserved for manufacturer data ? 16 bits used for the read-only locking mechanism ? 32 bits available as otp area ? 384 bits user programmable read/write memory
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 8 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.2 communication overview commands are initiated by the pcd and controlled by the mf0icu1?s command interpreter. this processes the internal st ates and generates the appropriate response. in all states, the command interpreter will return to the idle state on receipt of an unexpected command. if the ic was previously in the halt state, it will return to that state. fig 5. communication principle state diagram - 4-byte; 16-byte 001aak56 9 por idle state halt state s tat e diagram typical transaction time 5 ms without collision +1 ms for each collision read (16 bytes): 2.0 ms write (4 bytes): 4.6 ms c. write (4 bytes): 6.2 ms ready 1 state ready 2 state active state anticollision command anticollision command read of 16 byte write of 4 byte read command from address 0 read command from address 0 select command of cascade level 1 select command of cascade level 2 wupa command halt command reqa command wupa command memory operations identification and selection procedure
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 9 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.2.1 idle state after a power-on reset (por), the mf0icu1 swit ches directly to the idle state. it only exits this state when a reqa or a wupa co mmand is received from the pcd. any other data received while in the idle state is in terpreted as an error and the mf0icu1 remains idle. after a correctly executed halt command, the halt state changes to the wait state which can be exited with a wupa command. 8.2.2 ready 1 state in this state, the mf0icu1 supports the p cd when resolving the first part of its uid (3 bytes) with the anticollision or select command from cascade level 1. this state is exited correctly after execution of either of the following commands: ? select command from cascade level 1: the pcd switches the mf0icu1 into ready 2 state where the second part of the uid is resolved. ? read command (from address 0 ): all anticollision mechanis ms are bypassed and the mf0icu1 switches directly to the active state. remark: if more than one mf0icu1 is in the pcd field, a read command from address 0 causes a collision due to the differ ent serial numbers an d all mf0icu1 devices are selected. any other data received in the ready 1 state is interpreted as an error and depending on its previous state the mf0icu1 returns to the wait, idle or halt state. 8.2.3 ready 2 state in this state, the mf0icu1 supports the pcd when resolving the second part of its uid (4 bytes) with the cascade level 2 anticollis ion command. this state is usually exited using the cascade level 2 select command. alternatively, state ready 2 may be skipp ed using a read command (from address 0) as described in state ready 1. remark: if more than one mf0icu1 is in the pcd field, a read command from address 0 causes a collision due to the differ ent serial numbers an d all mf0icu1 devices are selected. the response of the mf0icu1 to the cascade level 2 select command is the select acknowledge (sak) byte. in accordance with iso/iec 14443 this byte indicates if the anticollision ca scade procedure has finished. it also defines the type of device selected for the mifare architectu re platform. the mf0icu1 is now uniquely selected and only this devi ce will communicate with the pcd even when other contactless devices are present in the pcd field. any othe r data received when th e device is in this state is interpreted as an error and depending on its previous state the mf0icu1 returns to the wait, idle or halt state. 8.2.4 active state in the active state either a 16-byte read or 4-byte write command can be performed. the halt command exits either the read or write commands in their active state. any other data received when the device is in this state is interpreted as an error and depending on its previous state the mf0icu1 returns to the wait, idle or halt state.
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 10 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.2.5 halt state the halt and idle states constitute the second wait state implemented in the mf0icu1. an already processed mf0icu1 can be set into the halt state using the halt command. in the anticollision phase, this state helps the pcd to distinguish between processed cards and cards yet to be selected. the mf0icu1 can only exit this state on execution of the wupa command. any other data received when th e device is in this state is interpreted as an error and the mf0icu1 state is unchanged . refer to the docume nt mifare collection of currently available applic ation notes for correct implem entation of an anticollision procedure based on the idle and halt states and the reqa and wupa commands. 8.3 data integrity reliable data transmission is ensured over the contactless communication link between pcd and mf0icu1 as follows: ? 16-bit crc for each block ? parity bits for each byte ? bit count checking ? bit coding to distinguish between logic 1, logic 0 and no information ? channel monitoring (protocol sequence and bit stream analysis) 8.4 rf interface the rf interface is base on the iso/iec 14443 a standard for contactless smart cards. the rf field from the pcd is always present as it is used for the card power supply. however, it is sequenti ally interrupted during data transmission to allow the data to be sent. there is only one start bit at the beginning of each frame for data communication irrespective of direction. each byte is tran smitted with an odd parity bit at the end of the byte. the lsb of the byte with the lowest selected block address is transmitted first. the maximum frame length is 163-bit: (16 data bytes + 2 crc bytes = 16 * 9 + 2 * 9 + 1 start bit = 163).
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 11 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.5 memory organization the 512-bit eeprom memory is organized in 16 pages with 4 bytes per page. in the erased state the eeprom cells are read as logic 0, in th e written state as logic 1. 8.5.1 uid/serial number the unique 7-byte serial number (uid) and its two check bytes are programmed into the first 9 bytes of memory covering page addre sses 00h, 01h and the first byte of page 02h. the second byte of page address 02h is reserved for internal data. these bytes are programmed by the ic manufacturer and beca use of the security requirements are write protected. in accordance with iso/iec 14443-3 check byte0 (bcc0) is defined as ct sn0 sn1 sn2 and check byte 1 (bcc1) is defined as sn3 sn4 sn5 sn6. sn0 holds the manufacturer id for nxp semiconductors (04h) in accordance with iso/iec 14443-3 and iso/iec 7816-6 amd.1 table 4. memory organization page address byte number decimal hex 0 1 2 3 0 00h serial number 1 01h serial number 2 02h serial number internal lock bytes lock bytes 303hotpotpotpotp 4 to 15 04h to 0fh user memory fig 6. uid/serial number 001aai00 1 msb lsb page 0 byte check byte 0 serial number part 1 serial number part 2 manufacturer id for nxp semiconductors (04h) 00000100 0123 page 1 0123 page 2 0123 internal check byte 1 lock bytes
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 12 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.5.2 lock bytes the bits of byte 02h and 03h of page 02h represent the field programmable read-only locking mechanism. each page from 03h (otp) to 0eh can be individually locked by setting the corresponding locking bit lx to lo gic 1 to prevent further write access. after locking, the page becomes read-only memory. the three least significant bits of lock byte 0 are the block-locking bits. bit 2 deals with pages 0eh to 10h, bit 01h deals with pages 09h to 04h and bit 00h deals with page 03h (otp). once the block-locking bits are set, t he locking configuration for the corresponding memory area is frozen. in figure 7 for example if bl15-10 is set to logic 1, then bits l15 to l10 (lock byte 2 bit[7:2]) can no longer be changed. the locking and block-locking bits are set by a write command to page 2. bytes 2 and 3 of the write command, and the contents of the lock bytes are bitwise or?ed and the result then be comes the new contents of the lock bytes. this process is irreversible if a bit is set to logic 1, it cannot be changed back to logic 0. the contents of bytes 0 and 1 of page 2 are unaffected by the corresponding data bytes of the write command. important security: to activate the new locking configuration after a write to the lock bit area, a reqa or wupa command must be carried out. fig 7. lock bytes 001aak57 0 l 7 l 6 l 5 l 4 l otp bl 15-10 bl 9-4 bl otp msb 8 page 2 lx locks page x to read-only blx blocks further locking for the memory area x lock byte 0 lock byte 1 91011 lsb l 15 l 14 l 13 l 12 l 11 l 10 l 9 l 8 msb lsb
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 13 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.5.3 otp bytes page 03h is the otp page and it is preset so th at all bits are set to logic 0 after production. these bytes can be bitwise modified using the write command. the write command bytes and the current contents of the otp bytes are bitwise or?ed. the result is the new otp byte contents. this pr ocess is irreversible an d if a bit is set to logic 1, it cannot be changed back to logic 0. 8.5.4 data pages pages 04h to 15h are the user read/write area. after production the data pages are initialized to the following values: ? page 04h is initialized to ffh ? pages 05h to 15h are initialized to 00h this memory area can be used as a 32 tick one-time counter. fig 8. otp bytes 001aak57 1 byte 12 13 14 15 page 3 example otp bytes otp bytes default value 00000000 00000000 00000000 00000000 1st write command to page 3 11111111 11111100 00000101 00000111 result in page 3 11111111 11111100 00000101 00000111 2nd write command to page 3 11111111 00000000 00111001 10000000 result in page 3 11111111 11111100 00111101 10000111
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 14 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.6 command set the mf0icu1 comprises th e following command set: 8.6.1 reqa the mf0icu1 accepts the reqa command only in the idle state. the response is the 2-byte atqa (44h). reqa and atqa comm ands are fully implemented in accordance with iso/iec 14443-3. 8.6.2 wupa the mf0icu1 accepts the wupa command only in the idle and halt states. the response is the 2-byte atqa (44h). wupa command is fully implemented in accordance with iso/iec 14443-3. table 5. reqa command code parameter data integrity mechanism response reqa 26h (7-bit) - - parity atqa 44h time units are not to scale and rounded off to the nearest 10 s fig 9. reqa 001aak5 72 90 s 80 s 180 s reader command time mf0icu1 response cmd (7-bit) atqa 26h 44h 00h table 6. wupa command code parameter data integrity mechanism response wupa 52h (7-bit) - - parity atqa 44h time units are not to scale and rounded off to the nearest 10 s fig 10. wupa 001aak57 3 90 s 80 s 180 s reader command time mf0icu1 response cmd (7-bit) atqa 52h 44h 00h
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 15 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.6.3 cascade level 1: anticollision and select commands the anticollision and select commands are based on the same command code. only the parameter byte is diffe rent. this byte is as the 70h definition in case of the select command. the mf0icu1 accepts thes e commands only in the ready 1 state. the response is part 1 of the uid. table 7. cascade level 1: anticollision and select commands command code parameter data integrity mechanism response anticollision 93h 20h to 67h part of the uid parity parts of uid select 93h 70h uid: first 3 bytes parity, bcc, crc sak (04h) time units are not to scale and rounded off to the nearest 10 s fig 11. cascade level 1: anticollision command 001aak5 74 190 s 80 s 430 s reader command time mf0icu1 response cmd ct 93h arg 20h 88h sn0 uid of cascade level 1 sn1 sn2 bcc1 time units are not to scale and rounded off to the nearest 10 s fig 12. cascade level 1: select command 001aak5 75 780 s 80 s 260 s reader command time mf0icu1 response cmd arg ct uid of cascade level 1 sak 93h 70h 88h sn0 sn1 sn2 bcc1 c0 crc c1 04h crc c1 c0
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 16 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.6.4 cascade level 2: anticollision and select commands the anticollision and select commands are based on the same command code. only the parameter byte is diffe rent. this byte is as the 70h definition in case of the select command. the mf0icu1 accepts thes e commands only in the ready 2 state. the response is part 2 of the uid. table 8. cascade level 2: antico llision and select commands command code parameter data integrity mechanism response anticollision 95h 20h to 67h part of the uid parity parts of uid select 95h 70h uid: second 4 bytes parity, bcc, crc sak (00h) time units are not to scale and rounded off to the nearest 10 s fig 13. cascade level 2: anticollision command 001aak5 76 190 s 80 s 430 s reader command time mf0icu1 response cmd 95h arg 20h sn3 sn4 uid of cascade level 2 sn5 sn6 bcc2 time units are not to scale and rounded off to the nearest 10 s fig 14. cascade level 2: select command 001aak5 77 780 s 80 s 260 s reader command time mf0icu1 response cmd arg uid of cascade level 1 sak 95h 70h sn3 sn4 sn5 sn6 bcc2 c0 crc c1 00h crc c1 c0
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 17 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.6.5 read the read command needs the page address as a parameter. only addresses 00h to 0fh are decoded. the mf0icu1 returns a nak for higher addresses. the mf0icu1 responds to the read command by sending 16 bytes starting from the page address defined by the command argument. for example; if address (adr) is 03h then pages 03h, 04h, 05h, 06h are returned. a roll-back is implemented for ex ample; if address (adr) is 0eh, then the contents of pages 0eh, 0fh, 00h and 01h are returned). 8.6.6 halt the halt command is used to set the mf0i cu1 ics into a different wait state (halt instead of idle), enabling devices whose uids are already known because they have passed the anticollision procedur e, to be separated from de vices yet to be identified by their uids. this mechanism is a very efficient way of finding all contactless devices in the pcd field. table 9. read command code parameter address data integrity mechanism response read 30h 00h to 0fh - crc 16-byte date time units are not to scale and rounded off to the nearest 10 s fig 15. read 001aak57 8 360 s 80 s 50 s 1540 s reader command time mf0icu1 response cmd arg crc 16 byte data 30h adr c0 c1 d0 d1 d2 ... d13 d14 d15 nak crc c1 c0 table 10. halt command code parameter address data integrity mechanism response halt 50h 00h - parity, crc passive ack, nak time units are not to scale and rounded off to the nearest 10 s fig 16. halt 001aak57 9 360 s 80 s 50 s reader command time mf0icu1 response cmd adr crc 50h 00h c0 c1 nak ack ---
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 18 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.6.7 write the write command is used to program the lock bytes in page 02h, the otp bytes in page 03h and the data bytes in pages 04h to 0fh. a write command is performed page-wise, programming 4 bytes in a row. 8.6.8 compatibility write the compatibility write command was implemented to accommodate the established mifare pcd infrastructure. even though 16 bytes are transferred to the mf0icu1, only the least significant 4 bytes (bytes 0 to 3) are written to the specified address. it is recommended to set the remaining bytes 04h to 0fh to all logic 0. table 11. write command code parameter address data code parameter write a2h 00h to 0fh 4-byte a2h 0 to 7 time units are not to scale and rounded off to the nearest 10 s fig 17. write 001aak58 0 700 s 80 s 50 s 50 s 3830 s reader command time mf0icu1 response cmd arg 4 byte data crc a2h adr d0 d1 d2 d3 c0 c1 nak ak table 12. compatibility write command code parameter address data integrity mechanism response compatibility write a0h 00h to 0fh 16-byte parity, crc ack or nak time units are not to scale and rounded off to the nearest 10 s fig 18. compatibility write 001aak5 81 360 s 80 s 80 s 3830 s 50 s 50 s 1540 s reader command time mf0icu1 response cmd arg crc a0h adr c0 c1 nak 50 s ak (nak) 16 byte data crc ... d15 c0 c1 d0
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 19 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 8.7 summary of relevant da ta for device identification 9. limiting values [1] exposure to limiting values for ext ended periods may affect device reliability. [2] stresses above one or more of the limiting values may cause permanent damage to the device. [3] these are stress ratings only. operation of the device at these or any other conditions above those given in section 10.1 ? electrical characteristics ? of the specification is not implied. [4] mil standard 883-c method 3015; human body model: c = 100 pf, r = 1.5 k . table 13. summary of relevant data for device identification code type value binary format remark atqa 2-byte 44h 0000 0000 0100 0100; 1 st 1 indicates cascade level 2 2 nd 1 indicates mifare family hard coded ct 1-byte 88h 1000 1000 hard coded cascade tag ensures collision with cascade level 1 products sak (cascade level 1) 1-byte 04h 0000 0100; 1 indicate s additional cascade level hard coded sak (cascade level 2) 1- byte 00h 0000 0000; indicates complete uid and mf0icu1 functionality hard coded manufacturer byte 1-byte 04h 0000 0100; indicates manufacturer nxp semiconductors in accordance with iso/iec 14443-3 and iso/iec 7816-6 amd.1 table 14. limiting values in accordance with the absolute maximum rating system (iec 60134) [1] symbol parameter conditions min max [2] [3] unit i i input current - 30 ma t stg storage temperature ? 55 125 c t amb ambient temperature ? 25 70 c v esd electrostatic discharge voltage measured between pins la and lb [4] 2- kv i lu latch-up current 100 - ma
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 20 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 10. characteristics 10.1 electrical characteristics [1] stresses above one or more of the limiting values may cause permanent damage to the device. [2] these are stress ratings only. operation of the device at these or any other conditions above those given in the characteristics section of t he specification is not implied. [3] lcr meter hp 4285: t amb = 22 c, cp-d, f i = 13.56 mhz, 2 veff. remark: exposure to limiting values for extended periods may affect device reliability table 15. characteristics symbol parameter conditions min typ max [1] [2] unit f i input frequency - 13.56 - mhz c i input capacitance 17 pf version [3] 14.85 17.0 20.13 pf 50 pf version [3] 42.5 50.0 57.5 pf eeprom characteristics t cy(w) write cycle time - 3.8 - ms t ret retention time t amb = 22 c5--year n endu(w) write endurance t amb = 22 c 10000 - - cycle
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 21 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 11. package outline fig 19. package outline sot500-2 unit d references outline version european projection issue date iec jedec jeita mm 35.05 34.95 for unspecified dimensions see pllmc-drawing given in the subpackage code. dimensions (mm are the original dimensions) sot500-2 03-09-17 06-05-22 - - - - - - - - - p llmc: plastic leadless module carrier package; 35 mm wide tape sot500- 2 a (1) max. 0.33 0 10 20 mm scale a detail x x note 1. total package thickness, exclusive punching burr. d
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 22 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 12. abbreviations table 16. abbreviations acronym description arg argument atqa answer to request (type a) bcc block check character cmd command crc cyclic redundancy check ct cascade tag eeprom electrically erasable programmable read-only memory iv initial value lsb least significant bit msb most significant bit nak negative acknowledge otp one-time programmable passive ack passive (implicit) acknowledge without picc answer pcd proximity coupling device pgdw potential good dies per wafer picc proximity integrated circuit card por power-on reset reqa request answer (type a) rf radio frequency sak select acknowledge (type a) uid unique identifier/identification wupa wake-up command (type a)
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 23 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 13. references [1] iso/iec 14443 a ? international organization for standardization/international electrotechnical commission: identific ation cards - contactless integrated circuit(s) cards - proximit y cards, part 1-4, type a [2] mifare interface platform type identification procedure ? application note, bl-id document number 0184, version number ** [3] mifare iso/iec 14443 picc selection ? application note, bl-id document number 1308, version number ** [4] mifare ultralight features and hints ? application note, bl-id document number 0731, version number ** [5] mifare ultralight as type 2 tag ? application note, bl-id document number 1303, version number ** [6] mifare (card) coil design guide ? application note, bl-id document number 0117, version number **
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 24 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 14. revision history table 17. revision history document id release date data sheet status change notice supersedes mf0icu1 v.3.8 20101222 product data sheet - mf0icu1_37 modifications: ? unit of write endurance corrected in cycles mf0icu1_37 20100414 product data sheet - 028636 modifications: ? figure 4 ?chip orientation and bondpad locations?: format updated 028636 20100212 product data sheet - 028635 modifications: ? updated information on memory content after production ? information on laser dicing types included (no separate wafer addendum needed) ? packaging information included ? fig. 4 ?chip orientation and bondpad locations?: format updated ? multiple minor changes ? section 5 ?legal information?: updated 028635 20080820 product data sheet - 028634 modifications: ? section 1 ?general description? and section 2 ?features?: rephrasing of sentences 028634 20080204 product data sheet - 028633 modifications: ? update ? general rewording of mifare des ignation and commercial conditions 028633 july 2008 product data sheet - 028632 modifications: ? exchange of figures 11 and 13 028632 april 2007 product data sheet - 028631 modifications: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name. 028631 march 2007 product data sheet - 028630 028630 march 2003 product data sheet - 028625 028625 march 2003 preliminary data sheet - 028624 028624 february 2003 preliminary data sheet - 028623 028623 january 2003 preliminary data sheet - 028622 028622 january 2003 preliminary data sheet - 028621 028621 january 2003 preliminary data sheet - 028620 028620 preliminary data sheet - 028610 028610 objective data sheet - -
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 25 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 26 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. mifare ? is a trademark of nxp b.v. mifare ultralight ? is a trademark of nxp b.v. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
mf0icu1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3.8 ? 22 december 2010 028638 27 of 28 nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic 17. tables table 1. ordering information . . . . . . . . . . . . . . . . . . . . .3 table 2. bonding pad assignments to smart card contactless module . . . . . . . . . . . . . . . . . . . . . . .4 table 3. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .5 table 4. memory organization . . . . . . . . . . . . . . . . . . . . 11 table 5. reqa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 table 6. wupa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 table 7. cascade level 1: anticollision and select commands . . . . . . . . . . . . . . . . .15 table 8. cascade level 2: anticollision and select commands . . . . . . . . . . . . . . . . .16 table 9. read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 10. halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 11. write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 12. compatibility write . . . . . . . . . . . . . . . . . 18 table 13. summary of relevant data for device identification . . . . . . . . . . . . . . . . . . . . . 19 table 14. limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 15. characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 table 16. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 17. revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 18. figures fig 1. mifare card reader . . . . . . . . . . . . . . . . . . . . . . .2 fig 2. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 fig 3. contact assignments for sot500-2 (moa4) . . . .4 fig 4. chip orientation and bondpad locations. . . . . . . . .6 fig 5. communication principle state diagram - 4-byte; 16-byte. . . . . . . . . . . . . . . . . . . .8 fig 6. uid/serial number . . . . . . . . . . . . . . . . . . . . . . . . 11 fig 7. lock bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 fig 8. otp bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 fig 9. reqa. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 fig 10. wupa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 fig 11. cascade level 1: an ticollision command . . .15 fig 12. cascade level 1: select command. . . . . . . . . .15 fig 13. cascade level 2: anticollision command . . .16 fig 14. cascade level 2: select command. . . . . . . . . .16 fig 15. read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 fig 16. halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 fig 17. write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 fig 18. compatibility write . . . . . . . . . . . . . . . . . . .18 fig 19. package outline sot500-2 . . . . . . . . . . . . . . . . .21
nxp semiconductors mf0icu1 mifare ultralight contactless single-ticket ic ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 22 december 2010 028638 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 1.1 key applications . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 contactless energy and data transfer. . . . . . . . 1 1.3 anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3.1 cascaded unique identification (uid) . . . . . . . 2 1.4 security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.5 delivery options . . . . . . . . . . . . . . . . . . . . . . . . 2 2 features and benefits . . . . . . . . . . . . . . . . . . . . 3 2.1 mifare rf interface iso/iec 14443 a . . . . . . 3 2.2 eeprom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 contactless smart card module . . . . . . . . . . . . 4 6 mechanical specification . . . . . . . . . . . . . . . . . 5 6.1 fail die identification . . . . . . . . . . . . . . . . . . . . . 5 7 chip orientation and bondpad locations . . . . . 6 8 functional description . . . . . . . . . . . . . . . . . . . 7 8.1 block description . . . . . . . . . . . . . . . . . . . . . . . 7 8.2 communication overview . . . . . . . . . . . . . . . . . 8 8.2.1 idle state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.2.2 ready 1 state . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.2.3 ready 2 state . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.2.4 active state . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.2.5 halt state. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.3 data integrity. . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.4 rf interface . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.5 memory organization . . . . . . . . . . . . . . . . . . . 11 8.5.1 uid/serial number. . . . . . . . . . . . . . . . . . . . . . 11 8.5.2 lock bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8.5.3 otp bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8.5.4 data pages . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8.6 command set . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.6.1 reqa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.6.2 wupa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.6.3 cascade level 1: anticollision and select commands . . . . . . . . . . . . . . . . 15 8.6.4 cascade level 2: anticollision and select commands . . . . . . . . . . . . . . . . 16 8.6.5 read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8.6.6 halt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8.6.7 write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8.6.8 compatibility write . . . . . . . . . . . . . . . . 18 8.7 summary of relevant data for device identification . . . . . . . . . . . . . . . . . . . . 19 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 19 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 10.1 electrical characteristics . . . . . . . . . . . . . . . . 20 11 package outline. . . . . . . . . . . . . . . . . . . . . . . . 21 12 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 22 13 references. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 14 revision history . . . . . . . . . . . . . . . . . . . . . . . 24 15 legal information . . . . . . . . . . . . . . . . . . . . . . 25 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 25 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 26 16 contact information . . . . . . . . . . . . . . . . . . . . 26 17 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 18 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 19 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

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